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Metalmach Micro Technology Sdn Bhd
Lot 17243, PT 4986,
Oakland Industrial Park,
Mukim Rasah,
70300 Negeri Sembilan,
Malaysia.
+606-764 8839
+606-764 8383

Wirebond Parts - Clamper

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Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
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Metalmach Micro Technology Sdn Bhd was established in 1979 as a company that manufactures and supplies a wide range of precision parts of engineering.

Contact Information


Lot 17243, PT 4986, Oakland Industrial Park, Mukim Rasah,
70300 Negeri Sembilan, Malaysia.


+606-764 8839
sales@mmtsb.com